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  1. Datacon Technology GmbH - RFID, Flip Chip, Multi Chip, SIP, MCM, CMOS

    high-precision assembly equipment for the advanced packaging market; specialist in the field of RFID, Flip Chip, System in Package (SIP), MCM, CMOS, Die Bonding
    sip2
    rfid tag1
    flip chip1
    die bonder1
    system in package1
    datacon1
    multi chip1
    thin die handling0

    www.datacon.at - 2009-02-08

  2. Amkor Technology: Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test

    Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and ...
    PoP4
    flip chip1
    system in package1
    amkor1
    unitive1
    wafer bump1
    amkor packaging0
    amkor technology0
    package on package0
    wafer bumps0
    wafer level pacakaging0

    www.amkor.com - 2009-02-07

  3. KGD Packaging & Test Workshop

    The annual KGD Packaging and Test Workshop in Napa, California focuses on semiconductor die products test, assembly, manufacturing, and business issues at the ...
    conference3
    workshop3
    seminar3
    package3
    tutorial3
    module2
    sip2
    semiconductor2
    reliability2
    wafer1
    dpc1
    stacked1
    burn-in1
    flip chip1
    chip on board1
    kgd1
    multi-chip1
    known good die1
    system in package1
    die products1

    www.napakgd.com - 2009-02-04

  4. Die Products Consortium (DPC)

    The DPC provides information on semiconductor test, assembly, and infrastructure related to known good die (KGD) and implementation of system-in-package (SiP) ...
    board4
    test3
    package3
    tutorial3
    assembly2
    chip2
    bond2
    module2
    pcb2
    sip2
    semiconductor2
    reliability2
    cob1
    wafer1
    stack1
    workmanship1
    mcm1
    dpc1
    flip chip1
    chip on board1
    multichip1
    bare die1
    known good die1
    system in package1
    wirebond1
    die products1
    die products conosortium0

    www.dieproducts.org - 2009-03-04

bga1 for sale4 assembly2 electronics4 pcb2 store4 abr2 module2 pbx2 circuit2 sip2 csp1 asterisk2 cms4 voip3 design7 modules2

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